{"product_id":"tsop56-tsop48-to-dip56-adapter-board-am29-series-chip-0-5-0-65mm","title":"TSOP56 TSOP48 to DIP56 Adapter Board AM29 Series Chip 0.5\/0.65mm","description":"\u003cp\u003e\u003cspan data-sheets-root=\"1\"\u003e\u003cstrong\u003eTSOP56 \/ TSOP48 to DIP56 Adapter PCB – SMD to DIP Conversion Board\u003c\/strong\u003e\u003cbr\u003eThe TSOP56 TSOP48 to DIP56 Adapter PCB is a conversion and prototyping board designed to interface TSOP (Thin Small Outline Package) memory ICs and SMD devices with standard DIP-format breadboards and through-hole sockets. Built using durable FR-4 fiberglass material with copper fire-retardant construction, this adapter board simplifies testing, programming, prototyping, and embedded hardware development involving TSOP flash memory and surface-mount ICs.\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eWhy it’s a System Essential:\u003c\/strong\u003e\u003cbr\u003e• TSOP to DIP Conversion: Converts fine-pitch TSOP48\/TSOP56 SMD packages into standard DIP format.\u003cbr\u003e• Breadboard Friendly Design: DIP 2.54mm spacing allows easy use with breadboards and standard sockets.\u003cbr\u003e• Supports Fine-Pitch SMD ICs: Reverse side supports 0.65mm pitch TSOP package conversion.\u003cbr\u003e• Durable PCB Construction: Built using FR-4 fiberglass material with copper fire-retardant protection.\u003cbr\u003e• Simplifies IC Programming \u0026amp; Testing: Useful for flash memory programming, debugging, and prototyping.\u003cbr\u003e• Backward Compatibility: Standard DIP spacing ensures compatibility with common development tools and sockets.\u003cbr\u003e• Ideal for Embedded Hardware Work: Commonly used for BIOS flash ICs, memory devices, and embedded repair work.\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eTechnical Specifications:\u003c\/strong\u003e\u003cbr\u003e• PCB Name: TSOP56 TSOP48 to DIP56 Adapter Board\u003cbr\u003e• Supported Package Types:\u003cbr\u003e • TSOP48\u003cbr\u003e • TSOP56\u003cbr\u003e • DIP56\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eMechanical Specifications:\u003c\/strong\u003e\u003cbr\u003e• DIP Pin Pitch: 2.54mm\u003cbr\u003e• TSOP Pitch Support: 0.65mm\u003cbr\u003e• Aperture Distance: 1.0mm\u003cbr\u003e• Board Thickness: 1.6mm\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003ePCB Material:\u003c\/strong\u003e\u003cbr\u003e• FR-4 Fiberglass Sheet\u003cbr\u003e• Copper Fire-Retardant PCB Construction\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eFeatures:\u003c\/strong\u003e\u003cbr\u003e• TSOP-to-DIP package conversion\u003cbr\u003e• Breadboard-compatible DIP spacing\u003cbr\u003e• Fine-pitch SMD IC support\u003cbr\u003e• Durable FR-4 PCB material\u003cbr\u003e• Suitable for IC programming and testing\u003cbr\u003e• Compact embedded prototyping solution\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eApplications:\u003c\/strong\u003e\u003cbr\u003e• Flash memory programming\u003cbr\u003e• BIOS chip interfacing\u003cbr\u003e• Embedded hardware debugging\u003cbr\u003e• SMD IC prototyping\u003cbr\u003e• Electronics repair work\u003cbr\u003e• Breadboard development\u003cbr\u003e• Educational electronics projects\u003cbr\u003e• DIY embedded systems\u003cbr\u003e• IC testing and development\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eBest For:\u003c\/strong\u003e\u003cbr\u003eIdeal for students, hobbyists, makers, engineers, repair technicians, and embedded developers working on flash memory programming, SMD prototyping, BIOS repair, embedded hardware development, and TSOP package IC interfacing applications requiring reliable TSOP-to-DIP conversion support.\u003c\/span\u003e\u003c\/p\u003e","brand":"TinkEdge","offers":[{"title":"Default Title","offer_id":46584056348871,"sku":"TE-VOLREGIC28-597","price":53.5,"currency_code":"INR","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0774\/6620\/6407\/files\/TSOP56TSOP48toDIP56AdapterBoardAM29SeriesChip0.50.65mm_1.png?v=1779640690","url":"https:\/\/shop.tinkedge.tech\/products\/tsop56-tsop48-to-dip56-adapter-board-am29-series-chip-0-5-0-65mm","provider":"TinkEdge","version":"1.0","type":"link"}